Method for producing mechanically flexible silicon substrate
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United States of America Patent
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Dec 13, 2016
Grant Date -
Aug 28, 2014
app pub date -
Aug 15, 2012
filing date -
Jul 11, 2011
priority date (Note) -
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Abstract
A method for making a mechanically flexible silicon substrate is disclosed. In one embodiment, the method includes providing a silicon substrate. The method further includes forming a first etch stop layer in the silicon substrate and forming a second etch stop layer in the silicon substrate. The method also includes forming one or more trenches over the first etch stop layer and the second etch stop layer. The method further includes removing the silicon substrate between the first etch stop layer and the second etch stop layer.
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