Ion implanter provided with a plurality of plasma source bodies
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United States of America Patent
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Dec 13, 2016
Grant Date -
Nov 12, 2015
app pub date -
Nov 25, 2013
filing date -
Nov 27, 2012
priority date (Note) -
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Abstract
The invention relates to an ion implanter that comprises an enclosure ENV having arranged therein a substrate carrier PPS connected to a substrate power supply ALT via a high voltage electrical passage PET, the enclosure ENV being provided with pump means PP, PS, the enclosure ENV also having at least two cylindrical source bodies CS1, CS2 free from any obstacle and arranged facing the substrate carrier. This implanter is remarkable in that it includes at least one confinement coil BCI1-BCS1, BCI2-BCS2 per source body CS1, CS2.
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