Integrated high-speed probe system
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United States of America Patent
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Dec 13, 2016
Grant Date -
Jan 22, 2015
app pub date -
Oct 3, 2014
filing date -
Apr 28, 2011
priority date (Note) -
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Abstract
An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.
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