Porous stamp assembly, and manufacturing method and apparatus of the same
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United States of America Patent
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Dec 13, 2016
Grant Date -
Jan 23, 2014
app pub date -
Feb 27, 2013
filing date -
Jul 20, 2012
priority date (Note) -
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Abstract
The present invention relates to a porous stamp assembly. The manufacturing method of the assembly comprises a first step of hermetically adhering a porous impression die member of thermoplastic resin to a front end face of a frame; a second step of fixing the die member embedded frame onto a mount that is to be in face-to-face relation with a thermal head attached to a seal carving device; a third step of putting the thermal head in contact with an impression surface of the porous impression die member, with a resin film interposed therebetween, and moving the thermal head and the porous impression die member relative to each other; and a fourth step of removing the die member embedded frame from the mount.
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