Multi-layer low temperature shrink film
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United States of America Patent
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Dec 13, 2016
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N/A
app pub date -
Feb 28, 2011
filing date -
Feb 26, 2010
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Abstract
A multi-layer low temperature heat shrink film comprising an abuse layer comprising styrene-butadiene block copolymer; a first tie layer comprising ethylene vinyl acetate; a gas barrier layer comprising polyvinylidene chloride; a second tie layer comprising ethylene vinyl acetate; and a sealant layer comprising a metallocene-catalyzed sealant, is disclosed.
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