Apparatus of mounting and removing component, method of mounting component and method of removing component

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United States of America Patent

PATENT NO 9517520
APP PUB NO 20130284707A1
SERIAL NO

13754351

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Abstract

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An apparatus for mounting and removing a component includes: a light source configured to radiate light toward a component supported by solder; a light sensor configured to sense displacement of the component; and a member mounted on the component, the member including a hole in a portion to be irradiated with the light of the light source.

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Patent Owner(s)

Patent OwnerAddress
FUJITSU LIMITED1-1 KAMIKODANAKA 4-CHOME NAKAHARA-KU KAWASAKI-SHI KANAGAWA 211-8588

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harada, Tooru Kawasaki, JP 16 89
Kusakabe, Yasuyuki Kawasaki, JP 1 1

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