Copper filling-up method
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United States of America Patent
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Dec 6, 2016
Grant Date -
Dec 19, 2013
app pub date -
Aug 23, 2013
filing date -
May 18, 2009
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Abstract
There is provided a method of well filling copper in a conductivity-rendered non-through hole having an aspect ratio (depth/hole diameter) of 5 or more on a substrate in a short period of time, and the method comprises using an acidic copper plating bath comprising a water-soluble copper salt, sulfuric acid, chlorine ion, a brightener and a copolymer of diallylamines and sulfur dioxide and filling copper in the non-through hole by periodic current reversal copper plating.
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