Electroplating baths of silver and tin alloys
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United States of America Patent
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Dec 6, 2016
Grant Date -
Dec 4, 2014
app pub date -
Jun 4, 2013
filing date -
Jun 4, 2013
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Abstract
Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.
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