Reactive film adhesive
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United States of America Patent
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Dec 6, 2016
Grant Date -
Jun 12, 2014
app pub date -
Dec 11, 2013
filing date -
Dec 11, 2012
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Abstract
An actinic radiation activated, thermally curable solid film adhesive is disclosed that includes a film forming polymeric binder, a cationically curable resin, and a cationic photoinitiator. The solid film adhesive is capable of being processed at temperatures up to 120° C. prior to exposure to actinic radiation without curing, has a latency period at room temperature following activation of the initiator, and is curable at temperatures above 50° C. following activation of the initiator.
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