Resin mold, production method thereof, and use thereof
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United States of America Patent
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Dec 6, 2016
Grant Date -
May 30, 2013
app pub date -
Aug 3, 2011
filing date -
Aug 6, 2010
priority date (Note) -
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Abstract
A resin mold includes a resin layer having a depressions and protrusions pattern formed in the surface thereof, and a release layer including a mold release agent and formed of uniform thickness on at least the depressions and protrusions pattern of the aforementioned resin layer. The aforementioned resin layer has a solvent soluble resin, and an additive that has bleeding ability with respect to the solvent soluble resin, has a substituent group capable of coupling with the aforementioned mold release agent, and has a substituent group having compatibility with the aforementioned solvent soluble resin. The aforementioned additive is localized in the vicinity of the aforementioned resin layer surface. The group of the additive capable of coupling with the mold release agent condenses with the aforementioned mold release agent so that the aforementioned resin layer and release layer are bonded together.
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