Chamber-less thermal joining system
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United States of America Patent
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Dec 6, 2016
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app pub date -
Aug 20, 2013
filing date -
Aug 20, 2013
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Abstract
Various embodiments of the invention include solutions for chamber-less thermal joining. A first aspect includes a system for performing a thermal joining of a joint space defined by a metallic part without an environmental chamber thereabout. The system may include an induction coil for heating an area adjacent to the joint space defined by the metallic part for the thermal joining of the joint space. The system may also include a gas lens for directing a shielding gas towards the joint space, and a valve system for controlling a flow of the shielding gas from the gas lens. A vacuum system creates a negative pressure in the metallic part to urge the shielding gas through the joint space during the thermal joining, thus allowing thermal joining of the metallic part without an environmental chamber thereabout.
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