High aspect ratio traces, circuits, and methods for manufacturing and using the same
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United States of America Patent
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Nov 29, 2016
Grant Date -
Sep 18, 2014
app pub date -
Mar 12, 2014
filing date -
Mar 13, 2013
priority date (Note) -
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Abstract
High aspect ratio trace circuits and methods of manufacture and use are provided herein. A method may include obtaining a substrate, the substrate having a reservoir for receiving a conductive ink and a plurality of trace voids that are arranged in a pattern, the plurality of trace voids each having a path of fluid connection to the reservoir, filling the reservoir with a conductive ink, placing a cover film over the plurality of trace voids, allowing the conductive ink to fill the plurality of trace voids via capillary action to create a plurality of conductive traces, and allowing the conductive ink in the plurality of conductive traces to dry.
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