Printed circuit board and manufacture method thereof
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United States of America Patent
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Nov 29, 2016
Grant Date -
Jan 22, 2015
app pub date -
Oct 3, 2014
filing date -
Apr 5, 2012
priority date (Note) -
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Abstract
A printed circuit board is disclosed having a substrate with an insulating layer, aluminum foil layers disposed on both sides of the insulating layer, and a through-hole formed in the insulating layer and aluminum foil layers. A metal layer is disposed over an exposed surface of the insulating layer positioned along an inner surface of the through-hole. A zinc film is positioned on a surface of the aluminum foil. A metal film is disposed over the zinc film. A plating film is disposed on a surface of the metal film. A circuit pattern is etched through the aluminum foil and the plating film.
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