Flexible substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9510441
SERIAL NO

14642945

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Abstract

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A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. The flexible heat-dissipating metal layer of the flexible heat-dissipating structure is connected with a bottom surface of the substrate by the adhesive. The circuit layer and the flexible heat-dissipating metal layer are made of same material.

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Patent Owner(s)

Patent OwnerAddress
CHIPBOND TECHNOLOGY CORPORATIONNO 3 LIHSIN 5 RD HSINCHU SCIENCE PARK HSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsieh, Chin-Tang Kaohsiung, TW 33 109
Tu, Chia-Jung Hsinchu County, TW 12 10
Wu, Fei-Jain Hsinchu County, TW 12 125

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