Thin film vapor deposition method and thin film vapor deposition apparatus
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United States of America Patent
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Nov 29, 2016
Grant Date -
Oct 31, 2013
app pub date -
Dec 29, 2011
filing date -
Jan 4, 2011
priority date (Note) -
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Abstract
Provided is a thin film vapor deposition method capable of implementing ALD or cyclic CVD without the need for operating a valve and vapor depositing a thin film with higher productivity over the conventional method. A thin film vapor deposition apparatus includes a substrate supporting portion having a plurality of substrate mounting portions; and a gas jetting portion comprising a source gas supplier, a reaction gas supplier, and a mixture gas supplier, provided at the upper portion of the substrate supporting portion in which the source gas supplier, the reaction gas supplier and the mixture gas supplier are radially placed, wherein the substrate supporting portion and the gas jetting portion are provided so as to be able to relatively rotate.
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