Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound
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United States of America Patent
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Nov 22, 2016
Grant Date -
Mar 20, 2014
app pub date -
Oct 24, 2011
filing date -
Nov 10, 2010
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Abstract
The invention concerns a solution for pretreating copper surfaces, and a method for pre-treating copper surfaces allowing the formation of a tight bond to plastic substrates. The solution comprises: a) hydrogen peroxide, b) at least one acid, and c) at least one nitrogen-containing, five-membered, heterocyclic compound, and d) additionally at least one nitrogen containing, adhesion-promoting compound, said compound comprising, or consisting of, lactams, non-quaternary fatty amines, amides and polyamides, connected at one or more of its nitrogen atoms with at least one residue of formula (I).
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