Method for manufacturing wiring board
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United States of America Patent
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Nov 22, 2016
Grant Date -
Jul 3, 2014
app pub date -
Dec 10, 2013
filing date -
Dec 28, 2012
priority date (Note) -
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Abstract
A method for manufacturing a wiring board according to the present invention includes the steps of preparing a supporting substrate having a product forming region and a marginal region; preparing a separable metal foil whose area is larger than that of the product forming region and is smaller than that of the supporting substrate; fixing the separable metal foil to the supporting substrate by burying into the supporting substrate; forming a build-up section on the buried separable metal foil; integrally cutting out the supporting substrate, the separable metal foil and the build-up section; obtaining a laminated body for wiring board composed of the second metal foil and the build-up section by separating the first metal foil and the second metal foil; and forming the wiring conductor layer by removing a part of the second metal foil.
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