Flip-chip on leadframe semiconductor packaging structure and fabrication method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 22, 2016
Grant Date -
May 5, 2016
app pub date -
Oct 29, 2015
filing date -
Oct 31, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Flip-chip on leadframe (FCOL) semiconductor packaging structure and fabrication method thereof are provided. A semiconductor chip with copper pillars formed there-over is provided. A barrier layer is formed on the copper pillars. A solder material is coated on the barrier layer. A layer of soldering flux is coated on the solder material. A leadframe with electric leads formed thereon is provided. An insulating layer is formed an the leadframe and having a plurality of openings to expose portion of the electric leads. The semiconductor chip is placed upside down onto the leadframe to have the soldering flux in contact with the portion of the electric leads exposed in the openings. The solder material flows back to form conductive interconnections between the copper pillars and the portion of the electric leads exposed in the openings. The semiconductor chip is packaged with the leadframe using a mold compound.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully