Preparation method of crystalline silicon film based on layer transfer

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United States of America Patent

PATENT NO 9502240
APP PUB NO 20160104615A1
SERIAL NO

14890081

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Provided is a preparation method of a crystalline silicon film. The method includes: 1) forming a mask for making a periodic silicon rod array on a monocrystalline silicon wafer substrate, and forming the periodic silicon rod array on the monocrystalline silicon substrate by a wet chemical etching or dry etching process; 2) forming barrier layers both on the surface of the monocrystalline silicon substrate and the surface of the silicon rod array for next selectively epitaxial growth of silicon; 3) exposing silicon cores on the heads of the rod array by a selective etching process to form a protruded silicon seeds out of the mother wafer substrate; 4) growing a continuous silicon film at the top of the rod array by a selective epitaxial chemical vapor deposition method using the exposed silicon cores as protruded seeds while leaving voids between the film and the mother wafer substrate; and 5) lifting off the silicon film and transferring the silicon film to a preset substrate, and the seeded substrate is reusable.

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Patent Owner(s)

Patent OwnerAddress
SHANGHAI ADVANCED RESEARCH INSTITUTE CHINESE ACADEMY OF SCIENCESNO 99 PUDONG NEW AREA ROAD SHANGHAI SHANGHAI SHANGHAI CITY SHANGHAI CITY 201210

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Xiaoyuan Shanghai, CN 43 205
Liu, Dongfang Shanghai, CN 31 667
Lu, Linfeng Shanghai, CN 5 3
Wang, Cong Shanghai, CN 208 651
Yang, Hui Shanghai, CN 265 893
Zhang, Wei Shanghai, CN 2625 19909

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