Multi-step location specific process for substrate edge profile correction for GCIB system
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United States of America Patent
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Nov 22, 2016
Grant Date -
Dec 3, 2015
app pub date -
Aug 10, 2015
filing date -
Nov 20, 2013
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Abstract
Disclosed are an apparatus, system, and method for scanning a substrate or other workpiece through a gas-cluster ion beam (GCIB), or any other type of ion beam. The workpiece scanning apparatus is configured to receive and hold a substrate for irradiation by the GCIB and to scan it through the GCIB in two directions using two movements: a reciprocating fast-scan movement, and a slow-scan movement. The slow-scan movement is actuated using a servo motor and a belt drive system, the belt drive system being configured to reduce the failure rate of the workpiece scanning apparatus.
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