Method for detecting defects during a laser-machining process and laser-machining device
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United States of America Patent
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Nov 22, 2016
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app pub date -
Dec 26, 2013
filing date -
Jun 29, 2011
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Abstract
Detection of defects during a machining process includes: moving a laser beam along a predefined path over multiple workpieces to be machined so as to generate a weld seam or a cutting gap in the workpieces; detecting, in a two-dimensional spatially resolved detector field of a detector, radiation emitted and/or reflected by the multiple workpieces; selecting at least one detection field section in the detection field of the detector based on laser beam control data defining movement of the laser beam along the predefined path or based on a previously determined actual-position data of the laser beam along the predefined path, wherein each detection field section comprises a region encompassing less than the entire detection field; evaluating the radiation detected in the selected detection field section; and determining whether a defect exists at the weld seam or the cutting gap based on the evaluated radiation.
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