Microelectromechanical system device having a hinge layer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 22, 2016
Grant Date -
Feb 4, 2016
app pub date -
Aug 1, 2014
filing date -
Aug 1, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microelectromechanical system (MEMS) device includes a substrate and at least one MEMS unit disposed on the substrate. The MEMS unit includes at least one first electrode, at least one second electrode, at least one landing element, and a hinge layer. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The landing element is disposed on the substrate. The hinge layer includes a hinge portion and at least one cantilever portion. The hinge portion is connected to the second electrode. The cantilever portion is connected to the hinge portion. The cantilever portion has a first opening and at least one spring disposed in the first opening and connected to at least one side of the first opening. When a voltage difference exists between the first electrode and the second electrode, the hinge portion is distorted and the spring thus touches the landing element.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2014 Application Filing Year
- G02B Class
- 7825 Applications Filed
- 6797 Patents Issued To-Date
- 86.87 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- G02B Class
- 0 % this patent is cited more than
- 9 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 22, 2028 |
