Methods for producing rectangular seeds for ingot growth
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United States of America Patent
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Nov 22, 2016
Grant Date -
Oct 29, 2015
app pub date -
Jul 9, 2015
filing date -
Dec 31, 2012
priority date (Note) -
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Abstract
A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots. The method also includes connecting quarter sections to the adhesive layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer, and slicing each of the quarter sections to separate the rectangular seed portions from the curved wing portions.
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