Method and device for embossing
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United States of America Patent
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Nov 22, 2016
Grant Date -
Aug 13, 2015
app pub date -
Sep 18, 2012
filing date -
Sep 18, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A process for embossing a structure in an embossing material that is applied on a substrate comprising the steps of embossing the embossing material by an embossing die and hardening the embossing material, wherein at least the substrate and/or the embossing die and/or at least one heating layer arranged between the substrate and the embossing material and/or between the embossing die and the embossing material are irradiated by means of microwaves for hardening the embossing material.
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International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- B05D:PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....
- G21H:OBTAINING ENERGY FROM RADIOACTIVE SOURCES; APPLICA....
- B82Y:SPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; ....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- G03F:PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNE....
- B29L:INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RE....
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