Family

Country	kind	publication No.	Filing Date	Type	Sub-Type

• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

• FERMI RESEARCH ALLIANCE, LLC

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Shen, Tengming	Naperville, US	2	5
# of filed Patents : 2 Total Citations : 5

Cited Art Landscape

Load Citation

• No Cited Art to Display

Loading Cited Art Landscape...

Patent Citation Ranking

• 0 Citation Count
• H01L Class

• 0 % this patent is cited more than
• 9 Age

Forward Cite Landscape

Load Citation

• No Forward Cites to Display

Loading Forward Cite Landscape...

Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	May 15, 2028

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
November 15, 2016	US,9496073,B2   US9496073B2	GRANTED PATENT AS SECOND PUBLICATION
October 02, 2014	US,20140296077,A1   US20140296077A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9755130

On-chip thermoelectric generator

---

Abstract

---

An on-chip thermoelectric generator comprises an integrated circuit comprising a substrate and at least one thermocouple integrated with the substrate, wherein the thermocouple is configured to convert a temperature difference into a voltage. A metal bump or metal pillar is thermally connected to a portion of the thermocouple for generating the temperature difference. The metal bump or metal pillar is electrically insulated from said at least one thermocouple. The metal bump or metal pillar is electrically connected to a component of the integrated circuit which is different from the thermocouple.

---

 

---

Description

---

Claims

---

Claims data not available

---

Legal Events

 

• MAFP2021
• PD2018
• I2018
• STCF2017
• P2016
• AS2014
• F2014

Date	Code	Event	Description
Jun 23, 2021	MAFP	MAINTENANCE FEE PAYMENT	free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4
Jan 10, 2018	PD	Priority Date
Jan 09, 2018	I	Issuance
Dec 20, 2017	STCF	INFORMATION ON STATUS: PATENT GRANT	free format text: PATENTED CASE
May 05, 2016	P	Published
Oct 30, 2014	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:QI, GONGSHIN;PERRY, KEVIN L.;REEL/FRAME:034068/0023 Owner name: GM GLOBAL TECHNOLOGY OPERATIONS LLC, MICHIGAN Effective Date: Oct 30, 2014
Oct 29, 2014	F	Filing