Halogen-free resin composition, and prepreg and laminate for printed circuits using the same
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United States of America Patent
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Nov 15, 2016
Grant Date -
Jan 28, 2016
app pub date -
Dec 8, 2014
filing date -
Jul 22, 2014
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Abstract
Halogen-free resin composition, prepreg, and laminate for printed circuits using same. Based on 100 parts by weight of organic solid matter, the resin composition comprises: (A) bisphenol-type epoxy resin: 30˜60 parts by weight; (B) benzoxazine resin: 5˜45 parts by weight; (C) alkyl phenol novolac hardener: 10˜30 parts by weight; (D) phosphorus-containing flame retardant. The bisphenol-type epoxy resin, with numerous alkyl branched chains and benzene rings in its structure, makes the composition possess high glass transition temperature, low water absorption, good thermal resistance, and excellent dielectric properties. Taking the alkyl phenol novolac as the hardener can sufficiently exert the advantages of excellent dielectric properties and low water absorption resulted from containing numerous alkyls. The prepreg and laminate for printed circuits made from halogen-free resin composition have high glass transition temperature, low dielectric constant, low dielectric dissipation factor, low water absorption, high thermal resistance, and good flame retardancy, processability and chemical resistance.
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