Methods and apparatus for cleaning semiconductor wafers
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United States of America Patent
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Nov 15, 2016
Grant Date -
Apr 26, 2012
app pub date -
Mar 31, 2009
filing date -
Mar 31, 2009
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Abstract
A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process by turn the semiconductor substrate or the ultra/mega sonic device clockwise or counter clockwise.
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