Array substrate having jump wire connecting first and second wirings
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United States of America Patent
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Nov 8, 2016
Grant Date -
Jan 28, 2016
app pub date -
Aug 20, 2014
filing date -
Jul 22, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure discloses an array substrate, manufacturing method thereof, and display device. The array substrate comprises: a first wiring and a second wiring located in a first metal layer; a first insulating layer covering the first metal layer, wherein the first insulating layer is provided with via holes corresponding to the first wiring and the second wiring respectively; and a jumper located in a second metal layer provided on the first insulating layer, wherein the jumper is connected with the first wiring and the second wiring through the via holes, thereby the first wiring and the second wiring being electrically conducted with each other through the jumper. The array substrate of the present disclosure can be used in liquid crystal television, liquid crystal display, mobile phone, tablet personal computer and other display devices.
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