Test socket having high-density conductive unit, and method for manufacturing same
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United States of America Patent
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Nov 8, 2016
Grant Date -
Oct 15, 2015
app pub date -
Apr 3, 2013
filing date -
Apr 3, 2012
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Abstract
The present invention relates to a test socket having a high-density conductive unit, and to a method for manufacturing same, whereby an elastic conductive sheet is arranged at a position corresponding to the terminal of the device, and includes a first conductive unit arranged in the thickness direction of an elastic material and an insulating support unit for supporting the first conductive unit. A support sheet is attached to the elastic conductive sheet and has through-holes corresponding to the terminal of the device. A second conductive unit is arranged in the through-holes of the support sheet in the thickness direction in an elastic material.
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