Heat plate structure
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United States of America Patent
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Nov 8, 2016
Grant Date -
Jan 14, 2016
app pub date -
Jul 8, 2014
filing date -
Jul 8, 2014
priority date (Note) -
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Abstract
A heat plate sealing method and structure thereof includes a) providing a bottom plate and a cover plate engaging with each other; b) providing a welding frame; c) disposing the welding frame between the bottom plate and the cover plate; d) placing solder on the welding frame; e) sandwiching the welding frame having the solder thereon between the bottom plate and the cover plate; and f) conducting thermal melting on the solder to seal the bottom plate and the cover plate. Therefore, a sealing structure is strengthened and the airtightness during a sealing process is enhanced.
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