Composite engineered wood material piece composed of an HDF mid-layer and an OSB bottom layer
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United States of America Patent
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Nov 8, 2016
Grant Date -
Mar 3, 2016
app pub date -
Sep 2, 2014
filing date -
Sep 2, 2014
priority date (Note) -
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Abstract
A composite engineered wood material piece, such as a floor board or wood material sheet, is comprised of a thin top quality wood material layer bonded onto a high density fiber board (HDF) material which is itself bonded onto a thick bottom substrate oriented strand board (OSB) material layer. The OSB material layer has its particle orientation in the top surface disposed parallel to the grain orientation in the top quality wood material layer. The HDF layer resists to the stress exhibited in the top layer and acts has a transition layer to secure the top layer to the bottom layer. It also strengthens the composite floor board or wood material sheet.
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