Pane having an electrical connection element
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United States of America Patent
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Nov 1, 2016
Grant Date -
Aug 20, 2015
app pub date -
Jul 24, 2013
filing date -
Aug 24, 2012
priority date (Note) -
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Abstract
A pane having a connection element, having; a substrate having an electrically conductive structure on at least a subregion of the substrate, the electrical connection element on at least a subregion of the electrically conductive structure, and a lead-free soldering compound which connects the electrical connection element to the electrically conductive structure in at least a subregion, wherein the lead-free soldering compound contains 58 to 62% by weight indium, 35 to 38% by weight tin, 1 to 3.5% by weight silver and 0.5 to 2% by weight copper.
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