Integrated circuit and a method to optimize strain inducing composites
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United States of America Patent
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Nov 1, 2016
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N/A
app pub date -
Jun 17, 2014
filing date -
Aug 19, 2011
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Abstract
A method to design an IC is disclosed to provide a uniform deposition of strain-inducing composites is disclosed. The method to design the IC comprises, determining a total strain-inducing deposition area on an IC design. Then, the total strain inducing deposition area is compared with a predefined size. A dummy diffusion area is modified to increase the total strain-inducing deposition area, when the total strain-inducing deposition area is below the predefined size. Finally, the strain-inducing deposition area is optimized. A method to manufacture the IC and the IC is also disclosed.
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