Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
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United States of America Patent
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Nov 1, 2016
Grant Date -
Aug 13, 2015
app pub date -
Feb 16, 2015
filing date -
Jun 30, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
The semiconductor device includes a tab including a chip supporting surface, and a back surface opposite to the chip supporting surface; a plurality of suspension leads supporting the tab; a plurality of leads arranged between the suspension leads; a semiconductor chip mounted on the chip supporting surface of the tab, the semiconductor chip including a main surface, a plurality of pads formed on the main surface, and a rear surface opposite to the main surface; a seal portion sealing the semiconductor chip such that a part of each of the leads is exposed from the seal portion; and a Pb-free solder formed on the part of each of the leads. A part of the rear surface of the semiconductor chip is contacted with the seal portion.
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