Conductive sealant compositions
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United States of America Patent
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Nov 1, 2016
Grant Date -
Mar 28, 2013
app pub date -
Sep 10, 2012
filing date -
Sep 16, 2011
priority date (Note) -
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Abstract
Embodiments of the present disclosure are directed to sealant compositions including a base composition with at least one sulfur-containing polymer, a curing agent composition, and an electrically conductive filler including carbon nanotubes and stainless steel fibers. The electrically conductive filler can be in either or both of the base composition and the curing agent composition. The sealant compositions are substantially Ni-free and exhibit unexpectedly superior EMI/RFI shielding effectiveness.
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