Cleaning composition and method for cleaning a semiconductor device substrate after chemical mechanical polishing
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United States of America Patent
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Nov 1, 2016
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Mar 20, 2014
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Sep 13, 2013
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Sep 17, 2012
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Abstract
An aqueous cleaning composition and method for post-CMP cleaning of a semiconductor device which contains a copper interconnect wherein the cleaning composition contains (A) N,N,N′-trimethyl-N′-(2-hydroxyethyl)ethylenediamine; and (B) at least one corrosion inhibitor selected from the group consisting essentially of uric acid, xanthine, theophyline, paraxanthine, theobromine, caffeine, guanine, hypoxanthine, adenine, and combinations thereof.
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