Electroconductive ink composition
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United States of America Patent
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Nov 1, 2016
Grant Date -
Mar 26, 2015
app pub date -
Apr 15, 2013
filing date -
Apr 16, 2012
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Abstract
An electroconductive ink composition comprising silver particles (A), a compound having a siloxane backbone with a functional group (B), and an organic solvent (C), the silver particles (A) having a protective layer containing an amino group-containing compound and having a mean particle size of 1 nm or more and 100 nm or less, the content of the compound (B) being 4% by weight to 8% by weight based on the total amount of the composition, can form a circuit pattern on a polymer film with low heat resistance, and the obtained circuit pattern has excellent adhesion to a substrate and high conductivity.
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