Wiring board and method for manufacturing the same
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United States of America Patent
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Oct 25, 2016
Grant Date -
Jul 30, 2015
app pub date -
Apr 7, 2015
filing date -
May 18, 2012
priority date (Note) -
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Abstract
A wiring board includes a first interlayer insulation layer, a second interlayer insulation layer formed on the first interlayer insulation layer and having an opening portion, first conductive pads formed on the second interlayer insulation layer, a conductive plane layer formed on the first interlayer insulation layer such that the conductive plane layer is exposed by the opening portion of the second interlayer insulation layer, a wiring structure positioned directly on the conductive plane layer such that the wiring structure is accommodated in the opening portion of the second interlayer insulation layer, and second conductive pads formed on the wiring structure such that the first conductive pads and the second conductive pads are set to be positioned on a same plane.
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