Power module substrate, power module substrate with heat sink, and power module
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United States of America Patent
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Oct 25, 2016
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app pub date -
Mar 29, 2013
filing date -
Mar 30, 2012
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Abstract
A power module substrate including an insulating substrate, a circuit layer formed on one surface of the insulating substrate, and a metal layer formed on the other surface of the insulating substrate, wherein the circuit layer is composed of copper or a copper alloy, one surface of this circuit layer functions as an installation surface on which an electronic component is installed, the metal layer is formed by bonding an aluminum sheet composed of aluminum or an aluminum alloy, a thickness t1 of the circuit layer is within a range of 0.1 mm≦t1≦0.6 mm, a thickness t2 of the metal layer is within a range of 0.5 mm≦t2≦6 mm, and the relationship between the thickness t1 of the circuit layer and the thickness t2 of the metal layer satisfies t1
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