Optical module package and its packaging method
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United States of America Patent
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Oct 25, 2016
Grant Date -
May 5, 2016
app pub date -
Jan 6, 2015
filing date -
Oct 31, 2014
priority date (Note) -
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Abstract
An optical module package includes a substrate having a recessed portion, a cover covered on the substrate and defining with the substrate a first chamber and a second chamber therebetween, the cover having a light-emitting hole disposed in communication with the first chamber, a light-receiving hole disposed in communication with the second chamber and a stop wall positioned in the recessed portion to separate the first chamber and the second chamber, a light-emitting chip and a light-receiving chip mounted at the substrate and respectively disposed in the first chamber and the second chamber, and two encapsulation colloids respectively mounted in the first chamber and the second chamber and respectively wrapped about the light-emitting chip and the light-receiving chip. Thus, the optical module package not only can prevent crosstalk but also can greatly reduce the manufacturing cost and the level of difficulty.
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