Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 25, 2016
Grant Date -
Jan 7, 2016
app pub date -
Sep 16, 2015
filing date -
Dec 17, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully