Panel
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United States of America Patent
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Oct 25, 2016
Grant Date -
Feb 26, 2015
app pub date -
Aug 25, 2014
filing date -
Aug 26, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A panel including a substrate, a plurality of wirings and a protection stacked layer is provided. The substrate has a device area, a bonding area and a wiring area connected between the device area and the bonding area. The wirings extend from the device area to the bonding area through the wiring area. The protection stacked layer extends from a side of the wiring area adjacent to the device area towards a side of the bonding area and is located on the wirings.
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