Probe tip heating assembly
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United States of America Patent
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Oct 25, 2016
Grant Date -
Nov 6, 2014
app pub date -
Nov 14, 2012
filing date -
Nov 14, 2011
priority date (Note) -
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Abstract
A heating assembly configured for use in mechanical testing at a scale of microns or less. The heating assembly includes a probe tip assembly configured for coupling with a transducer of the mechanical testing system. The probe tip assembly includes a probe tip heater system having a heating element, a probe tip coupled with the probe tip heater system, and a heater socket assembly. The heater socket assembly, in one example, includes a yoke and a heater interface that form a socket within the heater socket assembly. The probe tip heater system, coupled with the probe tip, is slidably received and clamped within the socket.
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