Miniaturized sensor comprising a heating element, and associated production method
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United States of America Patent
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Oct 25, 2016
Grant Date -
Jun 12, 2014
app pub date -
Jul 12, 2012
filing date -
Jul 13, 2011
priority date (Note) -
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Abstract
The invention relates to a miniaturized sensor having a heating element, and to an associated production method. The sensor includes a substrate, a cavity and a heat-insulating structure suspended above the cavity by areas connecting to the substrate. The heat-insulating structure includes at least two bridges extending above the cavity, the heating element being supported by said bridges, extending transversely thereto.
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