Circuit substrate having a circuit pattern and method for making the same

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United States of America Patent

PATENT NO 9474161
SERIAL NO

14933616

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Abstract

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A circuit substrate includes: an insulative substrate formed with a pattern of a recess, the recess being defined by a recess-defining wall that has a bottom wall surface and a surrounding wall surface extending upwardly from the bottom wall surface; a patterned metallic layer structure including at least a patterned active metal layer disposed within the recess, formed on the bottom wall surface of the recess-defining wall, and spaced apart from the surrounding wall surface of the recess-defining wall, the patterned active metal layer containing an active metal capable of initiating electroless plating; and a primary metal layer plated on the patterned metallic layer structure.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN GREEN POINT ENTERPRISES CO LTDTAICHUNG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liao, Pen-Yi Taichung, TW 39 77
Yi, Sheng-Hung Taichung, TW 23 91

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