Manufacturing method of radiator-integrated substrate and radiator-integrated substrate
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United States of America Patent
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Oct 18, 2016
Grant Date -
Feb 12, 2015
app pub date -
Mar 13, 2013
filing date -
Mar 19, 2012
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Abstract
A metal circuit board and a metal base plate are bonded to a ceramic substrate to form a metal-ceramic bonded substrate, then the metal base plate is arranged on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator, a jig having a concave R surface is arranged on another surface of the radiator with the jig butting against the another surface of the radiator, a jig having a convex R surface protruding toward the metal-ceramic bonded substrate is brought into contact with another surface of the metal circuit board, and the metal-ceramic bonded substrate and the radiator are heat-bonded while they are pressurized by the radiator side jig and the metal-ceramic bonded substrate side jig, wherein a curvature radius R (mm) of the convex R surface and the concave R surface is 6500≦R≦surface pressure (N/mm2)×2000+12000.
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