Forming a liquid ejection head with through holes and a depression
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United States of America Patent
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Oct 18, 2016
Grant Date -
Jan 23, 2014
app pub date -
Jul 18, 2013
filing date -
Jul 20, 2012
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Abstract
A method of manufacturing a substrate of a liquid ejection head including: forming a plurality of recesses in a silicon wafer; etching the silicon wafer with etchant to form a depression and a plurality of through holes formed from the plurality of the recesses in the depression; and manufacturing a plurality of substrates of the liquid ejection head from the silicon wafer by dividing the silicon wafer on the basis of through holes.
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