Arrangement of a heat sink and heat-generating electronic components housed thereon
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United States of America Patent
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Oct 18, 2016
Grant Date -
Jun 19, 2014
app pub date -
Dec 12, 2013
filing date -
Dec 14, 2012
priority date (Note) -
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Abstract
An arrangement of a heat sink and a heat-generating electronic component is provided. The heat sink has a main part and a moulding of plastic. The electronic component is mounted on a first surface of the main part with thermal contact to the main part. The moulding is mounted to a second surface of the main part, opposite the first surface, to provide structural strength to the arrangement. The moulding has a void provided through the moulding. As a result, once the moulding and the main part are mounted to each other, a portion of the second surface of the main part is exposed through the void.
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