Apparatus of chemical vapor deposition with a showerhead regulating injection velocity of reactive gases positively and method thereof

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United States of America Patent

PATENT NO 9469900
APP PUB NO 20150004313A1
SERIAL NO

14489660

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Abstract

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A method for chemical vapor deposition using a showerhead through which at least one reactive gas and a purge gas are injected over a substrate, wherein the method includes: disposing the showerhead such that the bottom surface of the showerhead is spaced apart from the substrate by a predetermined distance; supplying a reactive gas and an injection support gas into the showerhead, wherein reactive gases of different kinds are respectively delivered into compartments formed at inside of the showerhead; mixing each reactive gas with its corresponding injection support gas in each mixing zone at inside of the showerhead; supplying a purge gas into a separated compartment at inside of the showerhead; and injecting the reactive gas mixed with the injection support gas and the purge gas through a plurality of reactive gas exits and a plurality of purge gas exits formed at the bottom surface of the showerhead, respectively.

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Patent Owner(s)

Patent OwnerAddress
KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY89 YANGDAEGIRO-GIL IPJANG-MYEON SEOBUK-GU CHEONAN-SI CHUNGCHEONGNAM-DO 331-820
PIEZONICS CO LTD35-3 HONGCHEON-RI IPJANG-MYEON SEOBUK-GU CHEONAN-SI CHUNGCHEONGNAM-DO 331-825

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Byun, Chul Soo Seoul, KR 8 826
Han, Man Cheol Seoul, KR 5 584

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