Low void solder joint for multiple reflow applications
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United States of America Patent
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Oct 11, 2016
Grant Date -
Jul 10, 2014
app pub date -
Jan 16, 2014
filing date -
May 31, 2011
priority date (Note) -
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Abstract
Methods and apparatus are provided for attaching a heat spreader to a die and includes disposing a solder thermal interface material between a first surface of a die and a first surface of a heat spreader without disposing a liquid flux between the die and the heat spreader to form an assembly, wherein at least one of the first surface of the die and a first surface of the heat spreader have disposed thereon a metallization structure comprising a transition layer and a sacrificial metallization layer, the sacrificial metallization layer disposed as an outer layer to the metallization structure adjacent the solder thermal interface material; and heating the assembly to melt the thermal interface and attach the die to the heat spreader.
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